STRAIN HARDENING, SUBSTRUCTURE AND SURFACE RELIEF OF Cu–12 AT. % Al SINGLE CRYSTALS

10.25712/ASTU.1811-1416.2023.01.008

Abstract

Transmission electron microscopy was used to study the deformation relief at different stages of work hardening of Cu–12 at. % Al single crystals. The interrelation of the surface relief with the work hardening stages and substructural evolution was analyzed. The stage III of work hardening was confirmed to be determined by microtwinning processes. Features of the surface relief associated with the development of microtwinning in slip planes were revealed. The deformation relief at IV stage of deformation was shown to contain short curved shear lines. The condition for the beginning of the microtwinning process was formulated. The dislocation density required to start the microtwinning process was estimated. The estimates showed good agreement with the average dislocation density measured experimentally.